Integrated Stress State Sensors for Wire Bond Applications
Measure the Complete Stress State
Both In-plane and Out-of-Plane Stresses
Insure Reliability of Your Packages
JS Engineering Supplies the Die
Your Company Packages the Devices and Extracts the Sress State Data
OR
JS Engineering Extracts the Stress State Information for You
An Array of Die Sizes to Fit Your Application
- Standard Sizes:
- 2.5 mm x 2.5 mm
- 5 mm x 5 mm
- 10 mm x 10 mm
- Larger Die Available on Request
- 15 mm x 15 mm
- 20 mm x 20 mm
- 15 mm x 25 mm
- Wafer Thickness - 25 mils
- Wafers can be thinned upon request
WB100
- 2.5 mm x 2.5 mmTest Die
- 7 Sensor Rosettes
- 8-bit Chip ID
- Diode Thermometry
- Sub Surface Heater - Full Die Area
WB200
- 5 mm x 5 mm Test Die
- 10 Sensor Rosettes
- 9-bit Chip ID
- Diode Thermometry
- Sub Surface Heater - Full Die Area
WB400 (2 x 2 Array of WB200)
- 10 mm x 10 mmTest Die
- 23 Sensor Rosettes
- 9-bit Chip ID
- Diode Thermometry
- Sub Surface Heater - Full Die Area
